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* Which existing connector types are poised for exceptional sales growth? * What new electronic products and technologies are driving this connector growth? * How will the actual global financial economic breakdown and recovery impact the adoption rate of the latest interfaces? * Which industry segments will utilize these connectors? Which segments requires the roll-out of entirely new interfaces to cope with specific applications? * Who are the best manufacturers of these connectors? * How are power connectors being adapted to supply greater power and signal density while supporting system thermal management strategies? * How do connector manufacturers differentiate many defined by a niche specification? * What specific applications will drive the development of such connectors? * What is the forecasted global market price of these growth connectors over the 2009 through 2013 period? * How much on this growth will likely be influenced by formal, defacto or special-interest-group-generated standards? * What is driving increasing desire for electronic system design that conforms to standardized hardware platforms? * Which exiting connectors, defined by an industry standard, continue to evolve regarding bandwidth and signal density? * Will new system packaging techniques including orthogonal midplane designs become widely adopted within the next less than six years? * Will new material technology change the way connectors are created, fabricated and utilized? * Will systems according to 85-ohm impedance dominate the industry or co-exist with 100-ohm systems? * How will system designer requirement for higher speed and density interfaces influence the introduction of next-generation connector technology? * Are one-piece, high-performance edge connectors experiencing an increase? Why? * Has the performance/cost curve of fiber-optic connectors finally tipped the benefit to fiber over copper in I/O applications? * How will global environmental mandates influence the appearance of future interconnects? * How is the convergence of computing, communications and consumer entertainment influencing the design of interconnects? * What new classes of merchandise, for example wireless video, light-emitting diode illumination and renewable power generation, will demand the development of new interconnect systems? * What technology gaps exist that must be addressed to be able to satisfy next-generation equipment interconnect requirements? * What effect will the adoption of wireless devices placed on copper cabling and connectors? * How are design engineers addressing potentially conflicting objectives of signal density, power density and thermal density? * How is the trend toward mobile computing, communication and entertainment influencing the ability to deliver power? * Will smaller semiconductor geometries have problems with reduced potential to deal with ESD damage? * In what applications are high-speed Ethernet and Infiniband protocols most effectively applied? * How are global demographics influencing the development of the latest electronic products as well as overall market size? * How are high-speed backplane and I/O connectors evolving to cope with the issues of 40 to 100 Gb/s bandwidth? Are copper 40+ Gb/s interfaces a viable solution, or has copper finally reached its practical bandwidth limit? * How will connector manufacturers address potentially conflicting requirements for identical second sources and protection of intellectual property? * Will Serial ATA and SAS still dominate the storage interconnect landscape? * What new interfaces will dominate emerging automotive applications including infotainment, networking, power management and battery charging? * How will cloud computing and hardware virtualization influence the markets for computing equipment in the future? * All of these topics and others are discussed in this new report on Connector Types and Technologies Poised for Growth.